Technology Promotion

❖ APTE is a dynamic organisation that bridges the gap between academia and industry in the field of electronics. ❖ At APTE , we believe in the power of partnerships and networking. As the representative of the IMAPS (International Microelectronics Assembly and Packaging Society), 🇹🇩 Romanian Chapter, we actively promote technical advancements and facilitate knowledge sharing between industry representatives and academics. ❖ SIITME (International Symposium for Design and Technology of Electronic Packaging) is APTE's flagship event, bringing together researchers, professionals, and scientists from Europe. ❖ TIE (Interconnection Techniques in Electronics), including TIE M, TIE Plus and TIE M Plus, is a prestigious student competition organised by APTE, highlighting expertise in electronic module and PCB design. ❖ We are proud to collaborate with IEEE (Institute of Electrical and Electronics Engineers) as our valued partner. Our partnership with IEEE allows us to stay at the forefront of industry advancements, access global resources, and engage with a network of professionals. ❖ APTE collaborates with ASA (Automotive Skills Alliance) to drive skills development and knowledge transfer in the automotive electronics sector. By bridging the gap between academia and the automotive industry, APTE and ASA work together to drive innovation and enhance expertise in this rapidly evolving field. ❖ With a commitment to excellence, innovation, and professional collaboration, APTE shapes the future of Electronic Packaging, empowering the next generation of engineers.

❖ APTE is a dynamic organisation that bridges the gap between academia and industry in the field of electronics. ❖ At APTE , we believe in the power of partnerships and networking. As the representative of the IMAPS (International Microelectronics Assembly and Packaging Society), 🇹🇩 Romanian Chapter, we actively promote technical advancements and facilitate knowledge sharing between industry representatives and academics. ❖ SIITME (International Symposium for Design and Technology of Electronic Packaging) is APTE's flagship event, bringing together researchers, professionals, and scientists from Europe. ❖ TIE (Interconnection Techniques in Electronics), including TIE M, TIE Plus and TIE M Plus, is a prestigious student competition organised by APTE, highlighting expertise in electronic module and PCB design. ❖ We are proud to collaborate with IEEE (Institute of Electrical and Electronics Engineers) as our valued partner. Our partnership with IEEE allows us to stay at the forefront of industry advancements, access global resources, and engage with a network of professionals. ❖ APTE collaborates with ASA (Automotive Skills Alliance) to drive skills development and knowledge transfer in the automotive electronics sector. By bridging the gap between academia and the automotive industry, APTE and ASA work together to drive innovation and enhance expertise in this rapidly evolving field. ❖ With a commitment to excellence, innovation, and professional collaboration, APTE shapes the future of Electronic Packaging, empowering the next generation of engineers.